BDJSN Manual SMT Screen Printer 250x400mm

BDJSN Manual SMT Screen Printer User Manual

Model: Manual SMT Screen Printer 250x400mm

1. ആമുഖം

This manual provides detailed instructions for the safe and efficient operation, setup, and maintenance of your BDJSN Manual SMT Screen Printer. This machine is designed for accurately applying solder paste onto Printed Circuit Boards (PCBs) using a stencil, facilitating the Surface Mount Technology (SMT) assembly process.

Please read this manual thoroughly before operating the machine to ensure proper usage and to prevent damage or injury.

2. സുരക്ഷാ നിർദ്ദേശങ്ങൾ

  • Always wear appropriate personal protective equipment (PPE), such as safety glasses and gloves, when operating the machine and handling solder paste.
  • പ്രവർത്തന സമയത്ത് യന്ത്രം ചരിഞ്ഞുപോകുകയോ ചലിക്കുകയോ ചെയ്യാതിരിക്കാൻ സ്ഥിരതയുള്ളതും നിരപ്പായതുമായ ഒരു പ്രതലത്തിൽ സ്ഥാപിച്ചിട്ടുണ്ടെന്ന് ഉറപ്പാക്കുക.
  • ജോലിസ്ഥലം വൃത്തിയായും തടസ്സങ്ങളില്ലാതെയും സൂക്ഷിക്കുക.
  • Do not attempt to modify the machine. Use only original replacement parts if repairs are necessary.
  • പ്രവർത്തിക്കുമ്പോൾ കൈകളും വിരലുകളും ചലിക്കുന്ന ഭാഗങ്ങളിൽ നിന്ന് അകറ്റി നിർത്തുക.
  • Properly dispose of solder paste and cleaning materials according to local regulations.

3. പാക്കേജ് ഉള്ളടക്കം

Upon unpacking, verify that all components are present and undamaged. The package should include:

  • 1x BDJSN Solder Paste Printer
  • 1x Spatula (for solder paste handling)
  • 1x Mixing Knife (for solder paste preparation)
Solder Paste Printer with included spatula and mixing knife

Figure 3.1: The BDJSN Solder Paste Printer shown with the included spatula and mixing knife, essential tools for solder paste application and preparation.

4 സ്പെസിഫിക്കേഷനുകൾ

ഫീച്ചർസ്പെസിഫിക്കേഷൻ
വർക്ക് ബെഞ്ച് വലുപ്പം300 x 400 മി.മീ
Maximum Print Size250 x 400 മി.മീ
Maximum Screen Frame Size370 x 470 മി.മീ
പ്രിൻ്റിംഗ് രീതിമാനുവൽ
അടിവസ്ത്ര കനം0 - 80 മി.മീ.
Workbench Adjustment Amount10 mm (horizontal angle adjustment)
Printing Platform Height220 മി.മീ
കൃത്യത ആവർത്തിക്കുക± 0.01 മി.മീ
സ്ഥാനനിർണ്ണയ രീതിDatum or Hole Shape / Outline or Reference Hole
അളവുകൾ (L x W x H)540 x 380 x 390 മിമി
Diagram showing the dimensions and key specifications of the SMT Screen Printer.

Figure 4.1: Visual representation of the printer's dimensions and a summary of its key specifications, including workbench size, print size, and accuracy.

5. ഘടക ഐഡന്റിഫിക്കേഷൻ

Familiarize yourself with the various parts of the SMT Screen Printer before operation.

Labeled diagram of the SMT Screen Printer components including working platform, positioning needles, fixed plates, adjustment knobs, and base.

ചിത്രം 5.1: വിശദമായി view of the SMT Screen Printer with its main components labeled for easy identification. Key parts include the Working Platform, Positioning Needle, Fixed Plate, Y Axis Rotary Knob, Adjustable Foot Of Base, Counter Weight, Template Fixed Knob, Height Adjustment Knob, X Axis Rotary Knob, and Base.

  • പ്രവർത്തന പ്ലാറ്റ്ഫോം: The surface where the PCB is placed for printing.
  • Positioning Needle/Fixed Plate: Used to precisely align and secure the PCB on the working platform.
  • Y Axis Rotary Knob: Adjusts the working platform's position along the Y-axis.
  • X Axis Rotary Knob: Adjusts the working platform's position along the X-axis.
  • Adjustable Foot Of Base: Allows for leveling the entire machine on uneven surfaces.
  • കൗണ്ടർ വെയ്റ്റ്: Balances the screen frame for smooth lifting and lowering.
  • Template Fixed Knob: Secures the screen stencil frame in place.
  • ഉയരം ക്രമീകരിക്കൽ നോബ്: Controls the vertical distance between the screen stencil and the PCB.
  • അടിസ്ഥാനം: The main support structure of the printer.

6. സജ്ജീകരണം

6.1 അൺപാക്കിംഗും പ്ലേസ്മെന്റും

  1. പ്രിന്റർ അതിന്റെ പാക്കേജിംഗിൽ നിന്ന് ശ്രദ്ധാപൂർവ്വം നീക്കം ചെയ്യുക.
  2. Place the printer on a sturdy, level workbench in a well-ventilated area.
  3. ക്രമീകരിക്കുക Adjustable Foot Of Base (Figure 5.1) to ensure the machine is perfectly level and stable.

6.2 Screen Template Installation

  1. Lift the screen frame holder to its upright position (Figure 6.1).
  2. Place your SMT stencil (screen template) into the frame holder.
  3. Secure the stencil using the four Template Fixed Knobs with pressure plates (Figure 6.2). Ensure the stencil is firmly held without excessive tension.
The SMT Screen Printer with the screen template holder in the raised position, ready for stencil installation.

Figure 6.1: The screen template holder in the raised position, illustrating the space for stencil placement.

Close-up of the screen template fixed by four knobs with pressure plates, ensuring a fast and firm hold.

Figure 6.2: The screen template is secured by four knobs with pressure plates, providing a stable and firm attachment for printing.

6.3 PCB Positioning

  1. Place the PCB onto the പ്രവർത്തന പ്ലാറ്റ്ഫോം.
  2. ഉപയോഗിക്കുക Positioning Needles, Fixed Plates, ഒപ്പം Movable Ejector Pins (Figure 6.3) to precisely align the PCB. The movable ejector pins and support plate allow for flexible positioning, convenient for single or double-sided printing.
  3. Adjust the position of the PCB using the X Axis Rotary Knob ഒപ്പം Y Axis Rotary Knob (Figure 5.1) until it is perfectly aligned with the stencil apertures.
Image showing movable ejector pins and support plate for flexible PCB positioning, and circuit board positioning using pins and fixed plates.

Figure 6.3: The working platform features movable ejector pins and support plates for flexible PCB positioning, along with fixed rods and plates for precise circuit board alignment.

7. പ്രവർത്തന നിർദ്ദേശങ്ങൾ

7.1 Adjusting Printing Height

  1. Lower the screen frame until it rests just above the PCB.
  2. ഉപയോഗിക്കുക ഉയരം ക്രമീകരിക്കൽ നോബ് (Figure 5.1) which utilizes a spiral screw mechanism (Figure 7.1) to fine-tune the vertical distance between the stencil and the PCB. The goal is to achieve a small, consistent gap (snap-off distance) for optimal paste release.
Close-up of the steel mesh bracket with a spiral screw for height adjustment, allowing easy control of the stencil-to-PCB gap.

Figure 7.1: The steel mesh bracket incorporates a spiral screw for precise up and down height adjustment, enabling easy control over the printing gap.

7.2 Applying Solder Paste

  1. Using the provided spatula or mixing knife, apply a bead of solder paste across the top edge of the stencil, just above the PCB's printing area.
  2. Ensure an even distribution of paste along the width of the stencil.

7.3 The Printing Process

  1. With the screen frame lowered and the PCB aligned, use a squeegee (not included, but essential for printing) to spread the solder paste across the stencil.
  2. Apply even pressure and a consistent speed as you draw the squeegee across the stencil, ensuring the paste fills all apertures.
  3. After one pass, lift the screen frame carefully. The solder paste should now be deposited onto the PCB pads.
  4. Inspect the printed PCB for quality. The machine offers guaranteed repeatability and precision fine-tuning (Figure 7.2) for consistent results.
Illustrations highlighting guaranteed repeatability, adjustable height, and precision fine-tuning features of the SMT Screen Printer.

Figure 7.2: The printer's design ensures guaranteed repeatability, adjustable height for various PCB thicknesses, and precision fine-tuning for accurate alignment.

8. പരിപാലനം

8.1 ഉപയോഗത്തിന് ശേഷം വൃത്തിയാക്കൽ

  • Immediately after printing, clean the stencil thoroughly to prevent solder paste from drying and clogging the apertures. Use an appropriate stencil cleaner and lint-free wipes.
  • Clean any solder paste residue from the working platform and machine frame.
  • Ensure all moving parts are free of debris.

8.2 പൊതു പരിചരണം

  • Periodically check all knobs and fasteners to ensure they are tight.
  • Lubricate moving parts as needed with a light machine oil to ensure smooth operation.
  • Store the machine in a clean, dry environment when not in use.

9. പ്രശ്‌നപരിഹാരം

പ്രശ്നംസാധ്യമായ കാരണംപരിഹാരം
Incomplete Solder Paste DepositInsufficient squeegee pressure; clogged stencil apertures; incorrect snap-off distance.Increase squeegee pressure; clean stencil thoroughly; adjust height for optimal snap-off.
Solder Paste BridgingExcessive solder paste; too much squeegee pressure; stencil not clean; incorrect snap-off distance.Reduce paste amount; reduce squeegee pressure; clean stencil; adjust height.
Misalignment of PrintPCB or stencil not properly secured; X/Y axis knobs loose.Re-secure PCB and stencil; tighten X/Y axis knobs and re-align.
Uneven Paste ThicknessUneven squeegee pressure; warped stencil; uneven working platform.Apply consistent squeegee pressure; replace warped stencil; ensure machine is level.

10. വാറൻ്റിയും പിന്തുണയും

For warranty information and technical support, please refer to the documentation provided at the time of purchase or contact your vendor directly. Keep your purchase receipt as proof of purchase.

© 2023 BDJSN. All rights reserved.

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